GX5050 DIO Specifications

Feature

Value

Timing

Int. Test Clock

5Hz to 50MHz

Resolution, max

Greater of 1Hz or 0.2%

Int. B Block

1 to 120MHz

B Clock Resolution

0.2%

Internal Strobe Phase – Clock delay

4 - 18nS, 2nS steps

Ext. Test Clock

0 to 50MHz

Ext. Strobe

0 to 50MHz

Timing skew

3nS same card, 5nS between cards

Input/Output

Data Direction control

Input or Output, fixed during execution

I/O channel width

32

Channels per board

8, 16 or 32 (programmable)

Output low level

See GX I-O Modules and Interfaces User's Guide (PXI)

Output high level

See GX I-O Modules and Interfaces User's Guide (PXI)

Source/Sink current

See GX I-O Modules and Interfaces User's Guide (PXI)

Input low level

See GX I-O Modules and Interfaces User's Guide (PXI)

Input high level

See GX I-O Modules and Interfaces User's Guide (PXI)

Memory depth, steps

256K to 1M

Trigger

Software, external override, or conditional

Pause

Software, external override, or conditional

External Status & Control

Output Enable

Tri-state in 8-pin groups

Ext. Clock Enable

Internal, External and Select

Clock Output

As selected Test clock

External Strobe

As selected Input

External Event Bus

As selected 16 lines

Pause

As selected Override Input

Trigger

As selected Override Input

Run

As selected Indicator

B Clock

As selected Output

Power Requirements

3.3V Typical Power (mA):

200

3.3V Maximum Power (mA):

500

5V Typical Power (A):

1.4

5V Maximum Power (A):

2

Environmental

Operating Temp.

0 to 50°C

Storage Temperature

-20 to 70°C

Physical Properties

Bus Interface

PCI

Dimensions

Full-Size card

Weight